材料及部件

豁免范围及期限

基于ELV指令4(2)章, (b)(iv)点需要加贴标签或标识

2(c)(i). Aluminium alloys for machining purposes with a lead content up to 0,4 % by weight

2(c)(i) 含铅0.4%（重量比）的铝合金

Vehicles type approved before 1 January 2028 and spare parts for these vehicles

2028年1月1日前批准的汽车类型及相关零配件

3. Copper alloy containing up to 4 % lead by weight

3. 含铅4%（重量比）的铜合金

(3)

5(b)(i). Lead in batteries used in 12 V applications

5(b)(i).用于12V的电池中的铅

Vehicles and spare parts for these vehicles (3)

这类型汽车及其零配件

X

5(b)(ii). Lead in batteries for battery applications not included in entry 5(a) and entry 5(b)(i)

5(b)(ii).  5(a)和5(b)(i)不包含的电池中的铅

Vehicles  type approved before 1 January 2024 and spare parts for these vehicles

2024年1月1日批准的汽车类别及相应的零配件

X

8(g)(ii)Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:

(i) a semiconductor technology node of 90 nm or larger;

(ii) a single die of 300 mm2 or larger in any semiconductor technology node;

(iii) stacked die packages with dies of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.

8(g)(ii)用于在集成电路倒装芯片封装中的半导体晶体和载体之间完成可行的电连接的焊料中的铅，其中该电连接包括以下任何一种:

(i)90纳米或更大的半导体技术节点；

(ii)任何半导体技术节点中300 mm2或更大的单个晶体；

(iii)300mm2以上模具或300mm2以上硅插片的堆叠模

(1)

X